发明名称 METHOD AND DEVICE FOR SOLDERING LAMINATED PLATE
摘要 PURPOSE:To scatter flux solvent and to uniform flux to improve reliability of soldering by applying flux on the back of a laminated plate, and after heating the back, heating the surface by hot air and soaking the back in molten solder layer. CONSTITUTION:Flux is applied by a fluxer 2 on the back of a running laminated plate 1 and in the through hole and the back is preheated by a preheater 3. When hot air is blown from above the laminated plate 1 by a hot stove 4, the upper part of the laminated plate 1 is heated. The hot air goes into the through hole and scatters the solvent of flux applied on the upper part of the through hole. At the same time, the flux in the through hole is made uniform and made to the state suitable for soldering. When the surface of the laminated plate 1 is soaked in a molten solder tank 5, the molten solder arrives perfectly at the upper part of the through hole, and defective soldering is eliminated.
申请公布号 JPS6015063(A) 申请公布日期 1985.01.25
申请号 JP19830121671 申请日期 1983.07.06
申请人 SENJIYU KINZOKU KOGYO KK 发明人 KAWAMATA YUUJI
分类号 B23K1/08;(IPC1-7):B23K1/08 主分类号 B23K1/08
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