| 摘要 |
PURPOSE:To obtain the titled ceramic package, corrosion resistance thereof is excellent, leakage between pins thereof is little and reliability thereof is high, by encapsulating a semiconductor receiving vessel with specific glass. CONSTITUTION:A semiconductor chip is sealed with crystalline glass, which is changed into crystallites at a pour point or lower, grain size thereof extends over 50-300 mesh, OH content in glass thereof extends over 500ppm or less and acid resistance thereof extends over 0.05-0.3%. Glass does not flow sufficiently at a fixed temperature when grain size extends over 50 mesh or less, and suspension is not obtained sufficiently homogeneously when it extends over 300 mesh or more. When OH content extends over 500ppm or more, leakage between pins is too large, and the title ceramic package cannot be used. Leakage between the pins increases when acid resistance extends over 0.3% or more, and glass cannot be manufactured substantially when it extends over 0.05% or less. |
