| 摘要 |
<p>PURPOSE:To enable water-proof insulation simply at a high efficiency by providing the surface of the titled circuit with an ultraviolet ray setting resin layer, and making this layer as a cation linkage reagent type or a radical inversion type. CONSTITUTION:The upper and lower surface and the entire surface of the side surface of the hybrid IC are coated with the ultraviolet ray setting resin composed of epoxy resin in the 100 part, reactive diluent in 20 part, and triallyl sulfonate in the 10 part, all of which are expressed in terms of weight part, to a thickness of approx. 0.01mm.. Next, this is irradiated with ultravolet rays and hardened, thus being changed into a moisture-proof insulation film. At this time, a type wherein the linkage due to cation polymerization generates, or a reactive and resin, silicon resin, or the like is used as this resin, and filler and colorant are added as required.</p> |
