| 摘要 |
PURPOSE:To contrive high accuracy fixing and high yield production by a method wherein the sub-mount is fixed to a heat sink by the correction of chip position while the light emitting part of a laser chip is detected on the basis of the light emission thereof. CONSTITUTION:The heat sink 2 fixed on a stem 1 is installed after positioning on a base 16 with a heated being built-in. The sub-mount 3 is kept to a collet 17 by adsorption, and a required voltage is impressed on electrode needles 19 and 20 when a solder 15 on the heat sink comes to the state of fusion. Then, light emission 21 is picked up to image by means of a camera 23; a monitor TV24 displays photo strength (P) 27 of the light emitting part 26, and a TV25 the coordinates of the part 26. The photo strength is maximized by the movement of the collet 17 to the Z direction in the optical axis, and the position of the part 26 is adjusted to the origin by the movement and rotation to the X-Y directions. This construction enables the laser chip 4 to be fixed to the heat sink 2 with a high accuracy, thus producing a high yield. |
