| 摘要 |
PURPOSE:To reduce additionally processing time with a plating method for a through-hole printed board disposed as a cathode between a pair of anode plates by specifying the flow of a plating liquid. CONSTITUTION:A plating device 10 is provided with a plating cell 12, a pair of anode plates 14a and 14b facing each other in the cell 12, a through-hole printed board 16 as a cathode plate in the intermediate part thereof and flow disturbing plates 18a, 18b between the board and both anodes. The cell 12 is divided to an upper plating chamber 12a and a lower suction chamber 12b communicated with each other and has a suction pipe 20 provided with many apertures 201 in the chamber 12b. The plating liquid is sucked by a pump P1 connected to the pipe 20 and is discharged from the discharge pipes 22a, 22b in the upper part of the chamber 12a so that the strong liquid flow is generated in the plating liquid in the cell 12. The flow thereof is made turbulent by the plates 18a, 18b and is at the same time moved within the plane inclusive of the board 16. The plates 18a, 18b are constituted of rail elements 181a, 181b disposed with deviation of every 1/2 pitch and the board 16 is movable within the plane inclusive thereof. |
