| 摘要 |
<p>@ A dicing apparatus for cutting a semiconductor wafer into a plurality of microelectronic circuit dice each having bonding pads which are located near by and on both sides of a cutting street on the wafer, using a diamond dicing blade which is caught between a couple offlanges, fitted to a spindle rotating at very high speed, and cuts the wafer along the cutting street in up-cut and down-cut mode being applied cooling water from both sides of the rotating flanges and dicing blade, each side cooling water spurts from a coolant nozzle and is poured against a cutting interface. Each flange of a couple of the flanges have external form on the outer side-surface so that the major quantity of the cooling water splashed by the rotating flange flows along the formed outer side-surface and is violently poured on a surface of the wafer where is in sufficient distance from the bonding pad, avoiding the cutting . debris sticking into the bonding pad, when the dicing blade works in the down-cut mode. Each coolant nozzle is provided In a form of a slit along the coolant pipe which is located in . parallel with and close to the surface of the wafer having a guard or a guide so that the cooling water spurts from the nozzle and is poured toward the cutting interface aslant to the surface of the wafer for cooling the cutting interface effectively cooperating with the rotating flanges and dicing blade.</p> |
