发明名称 THIN FILM FORMING APPARATUS
摘要 PURPOSE:To unify gas concentration in the longitudinal direction of reaction tube by supplying gas through a through-hole connected to the gas supply path formed at the inside of flat plate electrode. CONSTITUTION:At the one end of reaction tube 1, a gas supply port 2 is provided, at the other end of reaction tube 1, a gas exhaust port 3 is provided. At the inside of such reaction tube, a flat plate electrode 5 which is formed with parallel multilayer and is capable of holding a semiconductor wafer 4 is arranged. The electrode 5 is connected to a high frequency power supply 6 and generates gas plasma at the electrode 5. At the inside of electrode 5, a gas supply path 6 is provided and the gas is supplied to the gas supply path 6 through the supply tube 7. A plurality of through-holes 8 are provided from the surface of electrode 5 to the supply path 6, in order to supply the gas to the periphery of wafer 4. The gas concentration in the reaction tube 5 can be unified through such constitution and thereby thickness of thin film formed on the wafer 4 can be unified.
申请公布号 JPS6012727(A) 申请公布日期 1985.01.23
申请号 JP19830118307 申请日期 1983.07.01
申请人 HITACHI SEISAKUSHO KK 发明人 SAKAI HIDEO
分类号 H01L21/205;H01L21/31;(IPC1-7):H01L21/205 主分类号 H01L21/205
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