| 摘要 |
<p>MINIATURIZED BUS BAR AND ASSEMBLY TECHNIQUE Structure for and a method of construction of miniaturized bus bars are presented wherein the bus bar incorporates discrete high capacitive elements between a pair of bus bar conductors, the high capacitive elements being defined by wafers of material having a high dielectric constant coated with layers of conductive polymer. The conductive polymer is used to bind the chips between the bus bar conductors.</p> |
