发明名称 |
Microelectronic device package employing capacitively coupled connections |
摘要 |
A microelectronic device including a passivation layer disposed on the top surface has disposed on a portion of its surface a bonding agent. The resulting structure is inverted and sealed to a package base, forming a hermetically sealed cavity. This protects the microelectronic device from the environment. External electrical connection to other electronic apparatus is effected by means of conductors disposed on the package base surface. Alternating current (AC) capacitive coupling contacts allow electrical coupling to the microelectronic device and prevent violation of the integrity of the passivation layer. This method realizes compact microelectronics device packages which can be mass produced from entire microelectronic device substrates.
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申请公布号 |
US5119172(A) |
申请公布日期 |
1992.06.02 |
申请号 |
US19910663347 |
申请日期 |
1991.03.04 |
申请人 |
MOTOROLA, INC. |
发明人 |
CHO, FREDERICK Y.;NORLEY, GERALD;PENUNURI, DAVID |
分类号 |
H01L23/522 |
主分类号 |
H01L23/522 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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