| 摘要 |
PURPOSE:To prevent the shortcircuit of wirings and the flow of the wirings by shifting the center of a semiconductor chip by half pitch from the external lead terminal of the true center, and shifting a bonding pad disposed at one side of the chip in the shifting direction to the vicinity of the opposed sides. CONSTITUTION:The center of a semiconductor chip 7 is shifted to the position displaced by half of a pitch P between external lead terminals from the center line for connecting the external lead terminal 21 at the true center of an external lead terminal 2 to an external lead terminal 22. A bonding pad 101 is shifted from a region 91 of the shifting direction to the region 92 of the opposed side. Thus, the distance between the terminal 22 and the pad 102 and the distance between the terminal 21 and the pad 101 can be shortened. Accordingly, the wire for bonding can be shortened. |
