发明名称 THROUGH-HOLE DEFECT INSPECTING APPARATUS
摘要 PURPOSE:To enable high speed processing, by scanning the detected image of the through-hole provided to a printed circuit board by a rotary mirror and a lens system while detecting leaked light from the through-hole to be inspected by and transmitted light from said through-hole to be inspected by a light detector. CONSTITUTION:Light 2 is allowed to vertically irradiate the surface of a printed circuit board provided with plural through holes 4 each having a conductive layer provided to the inner wall surface thereof and light is transmitted from the through-hole 4 having a defect. In addition, a mask 3 for blocking light 2 is provided on the through-hole 4 to be inspected of the printed circuit board 1. If a defect is generated to the conductive layer of the through-hole 4 to be inspected, light is condensed by a condensing part 5 and the condensed light is reflected by a rotary mirror 7 to be detected by detectors 10, 11. By this constitution, high speed processing can be performed.
申请公布号 JPS6010158(A) 申请公布日期 1985.01.19
申请号 JP19830119092 申请日期 1983.06.30
申请人 FUJITSU KK 发明人 ANDOU MORITOSHI;MITA KIKUO;KAKIGI GIICHI
分类号 G01N21/88;G01N21/956;(IPC1-7):G01N21/88 主分类号 G01N21/88
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