| 摘要 |
PURPOSE:To improve a connection between a bed section for a semiconductor chip and a bonding section while reducing cost by forming the nose surface of an internal lead opposite to the bed section to a square shape. CONSTITUTION:A resist pattern is formed to a bed section forming prearranged section for a semiconductor chip on a conductive material. The conductive material is removed selectively by an etching liquid while using the resist pattern as a mask, and internal leads 3..., noses thereof have rounded bonding sections, external leads 4... connected to the internal leads 3..., and a bed section 2 are shaped. The rear ends of the internal leads 3... and the external leads 4... are taped, and the resist pattern is removed. Rounded sections at the noses of the bonding sections are pressed by a mold, and the internal leads 3..., nose surfaces thereof have square-shaped bonding sections 11, are formed, thus forming a lead frame. |
