| 摘要 |
PURPOSE:To prevent a crack of a sheathing resin from occurring due to a heat cycle test and a heat impact test by using phenol resin as a sheathing material on a junction coating agent. CONSTITUTION:A semiconductor element 2 is bonded to a substrate 1, and a circuit is formed of ultrafine connecting wirings 3. To protect the element 2, a semiflexible silicon junction coating agent 4 is coated. Phenol resin 6' is used as a sheath to form a hybrid integrated circuit. Thus, heat expansion coefficient difference to the substrate 1 can be reduced. |
