| 摘要 |
PURPOSE:To improve humidity resistance by forming a bonding pad having double layer structure of aluminum and gold. CONSTITUTION:Gold is sputtered and evaporated on the surface of a bonding pad 5 consisting of aluminum, and a thin-film 9 composed of gold is formed to the bonding pad section by using pattern forming technique employing a photo- resist. A metallic small-gage wire 3 consisting of gold is bonded with the thin- film 9. |
