| 摘要 |
PURPOSE:To facilitate positioning of a semiconductor element and a conductor pattern when face down bonding is to be performed, and to contrive to enhance mass producibility of a semiconductor device by a method wherein both an insulating substrate of wiring substrate and the conductor pattern to be adhered thereon are formed of transparent materials. CONSTITUTION:An insulating substrate 2 is formed of a transparent ceramic material such as polymer glass, plastics, a sapphire, etc., and conductor patterns 3, 5 are formed of a transparently good conductor such as ITO, SnO2, etc. Moreover insulating layers 4 are also formed of a transparently insulating material consisting of acrylic resin, epoxy resin, silicon, etc. A flip chip semiconductor element 6, an IC chip for example, having electrode terminals 7 forming solder bumps is eonnected to be fixed on a laminar conductor pattern 15 facing the electrode terminals 7 formed surface to the wiring substrate 1 side, namely according to face down bonding. At this case, because the connecting places can be confirmed according to the naked eye, etc., for example, through the substrate 2, the conductor pattern 3, the insulating layer 4 and the conductor pattern 5, positioning thereof is easy. |
