发明名称 EPOXY RESIN MOLDING MATERIAL FOR SEALING SEMICONDUCTOR
摘要 PURPOSE:To provide the titled molding material having excellent moldability and capable of giving a cured article having excellent moisture resistance, corrosion resistance and flexibility, by compounding an epoxy resin, a hardener, a cure accelerator, a filler, a rubber component and a fatty acid amide. CONSTITUTION:The objective molding material is obtained by compounding (A) an epoxy resin (preferably a novolac epoxy resin having an epoxy equivalent of 170-300), (B) a phenolic resin hardener (preferably a novolac phenolic resin having a softening point of 60-120 deg.C, and its amount is preferably 0.8-1.2 equivalent per 1 equivalent of the component A), (C) an organic phosphine compound (e.g. triphenylphosphine, etc.; 0.01-5wt% based on the sum of the components A and B), (D) an inorganic filler (e.g. clay), (E) a rubber component having unsaturated double bond in the molecular skeleton (e.g. polybutadiene) and (F) a higher fatty acid amide and/or polyvalent amide.
申请公布号 JPS608315(A) 申请公布日期 1985.01.17
申请号 JP19830115952 申请日期 1983.06.29
申请人 TOSHIBA KK 发明人 AZUMA MICHIYA;IKETANI HIROTOSHI
分类号 C08K3/00;C08G59/00;C08G59/40;C08G59/44;C08G59/62;C08K5/49;C08K13/02;C08L21/00;C08L63/00;H01B3/40;H01L23/29;H01L23/31 主分类号 C08K3/00
代理机构 代理人
主权项
地址