| 摘要 |
PRINTED CIRCUIT BOARD ASSEMBLY MANUFACTURE During printed circuit board manufacture, providing solder paste upon terminal lands of circuitry and also upon lands surrounding vias extending through the board. The solder is caused to flow during reflow soldering to connect surface mount components to the terminals and also to block the vias. This process ensures complete blocking of the vias and thus avoids permanently open via structures when attempting to block vias by wave soldering.
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