| 摘要 |
PURPOSE:To provide a photosensitive resin compsn. easily formable into a thin protective layer, and having superior characteristics, such as resolution, adhesiveness to metals, electric insulating property, and etching resistance. CONSTITUTION:A photosensitive resin compsn. contains (a) a photopolymerizable compd. having at least 2 terminal ethylenic groups, (b) a compd. represented by formula [ I ] in which Z is a cyclic dibasic acid residue; R<1> is 1-3C alkylene; R<2> is H or methyl; and X is Cl or Br, (c) a compd. having an epoxy group, and (d) a sensitizing agent allowed to produce free radicals by irradiation of actinic rays. A base plate to be processed and protected is coated with said compsn. in 10-300nm thickness, a negative film is applied onto it. It is imagewise exposed to actinic rays, and developed to form a protective film. The obtained imagewise protective film serves as an etching-resistant film for ordinary etching and plating, etc. It is further enhanced in heat resistance and mechanical characteristics by actinic ray exposure after development and heat treatment at 80- 200 deg.C, thus permitting uses as a permanent protective film for a solder mask, etc. |
