发明名称 |
RESIN SEALED TYPE SEMICONDUCTOR DEVICE |
摘要 |
PURPOSE:To improve the moisture proofing reliability by a method wherein thickness of a part starting from a point 0.2mm. or more inside the resin surface of an internal lead to a point as the ending point of bending external lead is reduced by 1/3 down to 2/3 thickness of the other parts. CONSTITUTION:The thickness of a part 8 starting from a point 0.2mm. inside the surface (a) of a resin 4 of a lead 7 to a point as the ending point of bending external lead is reduced by 1/3 down to 2/3 thickness of the other parts. In such a constitution, the moisture proofing reliability may be improved remarkably since the external lead bending force may be reduced diminishing the stress on the resin and preventing any chipping and cracking at a resin part (b) from happening. On the other hand, the drawing strength of the lead may be increased. |
申请公布号 |
JPS607747(A) |
申请公布日期 |
1985.01.16 |
申请号 |
JP19830115521 |
申请日期 |
1983.06.27 |
申请人 |
NIPPON DENKI KK |
发明人 |
KOBAYASHI YASUHISA;KINOSHITA TAKASHI |
分类号 |
H01L23/50;H01L23/28;H01L23/31;H01L23/495 |
主分类号 |
H01L23/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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