发明名称 PLASTIC MOLDING MATERIAL
摘要 PURPOSE:To provide plastic molding material for the housing of a digital electronic device or a radio, etc. excellent in electromagnetic wave cut-off properties and moldability by making conductive filler and thermoplastic plastics in the form of a pellet with a specific diameter. CONSTITUTION:Conductive filler (composed, for example, of metal such as stainless steel, aluminium, brass or magnesium, etc. and carbon and takes the form of a flake with a thickness of 0.1mm. max. and a surface area of 4mm.<2> max.) and thermoplastic plastics are mixed at 90:10-75:25 (by volumetric ratio) and extruded to obtain the target plastic molding material in the form of a pellet with a diameter 3.5-7mm..
申请公布号 JPS608014(A) 申请公布日期 1985.01.16
申请号 JP19830116423 申请日期 1983.06.27
申请人 ARON KASEI KK 发明人 HASEGAWA TADASHI;SUZUKI TADANOBU;IZUMO KAZUYUKI
分类号 C08K3/00;B29B9/06;B29B9/12;B29K105/16;C08K3/02;C08K3/08;C08L1/00;C08L7/00;C08L21/00;C08L23/00;C08L27/00;C08L33/00;C08L33/02;C08L51/00;C08L51/02;C08L77/00;C08L101/00;(IPC1-7):B29B9/12 主分类号 C08K3/00
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