发明名称 Semiconductor device having an amorphous metal layer contact
摘要 A metallization system for high temperature use comprises a layer strongly bonded to the surface of a semiconductor substrate in the form of an alloy of a metal in the amorphous state in which the metal is a transition metal, transition metal/normal metal alloy or transition metal/metalloid alloy having a crystallization temperature from the amorphous state in excess of 200 DEG C. The as-deposited amorphous films exhibit good adhesion and show at least an order of magnitude improvement in corrosion protection compared to polycrystalline coatings. Annealing treatments below the glass transition temperature have been found to further enhance this protective behavior of the amorphous films.
申请公布号 US4494136(A) 申请公布日期 1985.01.15
申请号 US19820419589 申请日期 1982.09.17
申请人 WISCONSIN ALUMNI RESEARCH FOUNDATION 发明人 PEREPEZKO, JOHN H.;WILEY, JOHN D.
分类号 H01L21/285;H01L21/48;(IPC1-7):H01L29/12;H01L23/54 主分类号 H01L21/285
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