发明名称 DEVICE FOR RESIN-SEALING SEMICONDUCTOR ELEMENT
摘要 PURPOSE:To contrive the reduction of the molding time and the improvement of quality by interposing a wave guide for resin pre-heating in the halfway of a molded-resin supply guide. CONSTITUTION:The upper metal mold 4 is provided under the upper supporting frame 3 of the upper die 1 which can be split, and the lower metal 6 above the lower supporting frame 5 of the lower frame 2 in opposition thereto. Fused resin is guided via metal molds 4, 6 and gate part 10. Besides, the molded resin is supplied through a supply guide 12, and the wave guide 16 connected to a micro wave generating device 18 is interposed in the halfway of the guide. In this manner, the resin 11 is fast in reaching the condition of a fusing temperature because of pre-heating by means of microwaves, and accordingly the reduction of the molding time and high quality can be secured.
申请公布号 JPS607136(A) 申请公布日期 1985.01.14
申请号 JP19830115372 申请日期 1983.06.27
申请人 TOSHIBA KK 发明人 NODA YASUMASA
分类号 H01L21/56;B29C45/02;B29C45/18;B29C45/72;B29K105/20;B29L31/34;(IPC1-7):H01L21/56 主分类号 H01L21/56
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