| 摘要 |
PURPOSE:To shorten the time for processing and thus reduce the deterioration of chip performance by transcribing a bump formed separately to a substrate electrode, and then bonding a semiconductor chip. CONSTITUTION:The Au bump 11 formed on a Ti-Pd film 10 on the substrate 9 is transcribed to a lead 12 by thermal compression bonding. Next, the pad 14 of the chip 13 is transferred above the bump 11 and put to bonding. This manner enables to shorten the time for processing because of the formation of the bump not on the chip but on the lead, leading to less deterioration of chip performance. |
