| 摘要 |
<p>PURPOSE:To provide a thin film multilayer wiring board and a method for manufacturing the same in which interlayer wirings can be shielded by enhancing the wiring density, the mounting density of surface components such as an LSI, and further reducing the propagation delay of a signal. CONSTITUTION:A power source pattern 6 and a ground pattern 7 having a spread are provided on a predetermined thin film wiring layer, the power source pattern and the ground pattern formed on both surfaces of a base board are connected via a through hole conductor of the base board, and the power source pattern 6 and the ground pattern 7 of the wiring layer are connected to the pattern 6 and the pattern 7 of the board via a blind hole conductor 8. The conductor 8 is formed simultaneously with a conductor pattern of a front surface by plating at each wiring layer.</p> |
