| 摘要 |
PURPOSE:The titled heat-radiating thermosetting paste useful for nonelectrically- conductive one-pack type mount, having improved mount strength, heat radiation, workability, curing properties, etc., consisting of a specific thermally conductive filler, an epoxy resin, a curing agent, and a curing promotor. CONSTITUTION:The desired paste consisting of (A) a thermally-conductive filler having >=10K/Wm<-1>K<-1>(0 deg.) thermal conductivity, (B) an epoxy resin consisting of a mixture of mixture of a liquid alicyclic epoxy resin and a glycidyl type polyfunctional epoxy resin, having <=300ppm (weight) hydrolyzable halogen group, (C) a curing agent consisting of dicyanidiamide, and (D) a curing promotor consisting of a tertiary amine. |
