| 摘要 |
PURPOSE:To remove the resin burrs of leads of a frame or between the leads easily in a short time by irradiation with laser beam. CONSTITUTION:Irradiation with laser beam removes the resin burrs of leads of a frame or between the leads. For example, a transporting member which is intermittently actuated transports a resin-mold semiconductor device 3 to place it right under a mask 14. Subsequently, a laser oscillator is actuated to project the laser beam 17 which goes through a deflecting member 12, a condensing lens 13 and slits 16, 16 of the mask 14 to irradiate the resin burrs 5... on the leads 4 or between the leads 4 of the semiconductor device 3 and to remove them by sublimation. |
