Power semiconductor module

摘要

A plastic-encapsulated power semiconductor module having a mechanically fixed baseplate providing good heat transmission is proposed in which a metal plate (9) is bonded to a substrate (5) and a plastic housing (6) with the aid of an elastic adhesive heat-conducting paste (14). The plastic housing (6) may additionally be joined to the metal baseplate (9), for example with rivets (10). The adhesive action of the heat-conducting paste (14) prevents it gradually softening after frequent changes in load. As a result of the elastic properties of the paste (14), it is also possible to compensate for fairly large differences in expansion between substrate (5) and metal baseplate (9). <IMAGE>