Integrated circuit strips having connecting leads

摘要

In integrated circuit strips (punched strips, having connecting leads, the problem arises that, because of the escape of encapsulation compound from the housing during the injection process, cutting the connecting leads free presents difficulties and results in premature wear of the punching tool. In order to eliminate this drawback, it is proposed to provide the circuit strip with at least one barrier in each case for inhibiting the outward flow of encapsulation compound at the points where the encapsulating compound which insulates the individual conductor tracks from one another emerges from the housing so that a punching and bending region which is free of encapsulation compound is obtained at the sealing ridge (Fig. 4).