| 摘要 |
PURPOSE:To enable to perform ball bonding according to an Al fine wire by a method wherein the metal wire whose surface is coated with an insulating film having a fusion point higher than the fusion point of the metal wire is used. CONSTITUTION:At this wire bonding, an Al fine wire 7 formed uniformly with an insulating film 8 previously is used. As action of the film 8 thereof, because it is to check a phenomenon that an arc 5 is not concentrated to the tip of the fine wire 7, and to creep up the side, for a property needed for the film 8, the film is not fused and dissolved at the fusion point of Al, and to prevent the fine wire 7 from the arc 5. Therefore to make the film to be provided with a fusion point higher than the fusion point of Al is necessary. When formation of a ball is performed according to arc discharge using the fine wire 7 formed with the film 8, faults such as breaking or bending of the fine wire 7, generation of a deformed ball, etc. are not generated, and the ball 3 of the prescribed size is formed at the tip of the fine wire stably. |
