GOLD ELECTROPLATING BATH AND PROCESS

摘要

Electrolytes for the electrodeposition of gold metal on substrates containing alkali metal or ammonium gold cyanides, a conducting agent, optionally a buffering agent, and at least 30 grams per liter of a grain refiner selected from the group consisting of oxalic acid, formic acid, and the alkali metal or ammonium salts thereof. The electroplating baths of the invention are operated at 2 pH of from 5 to 7.5, a temperature of 50.degree. to 80.degree.C., and a current density ranging from 1 to 20 ASF. The method of using the gold metal electroplating baths of this invention is also described and claimed.