| 摘要 |
PURPOSE:To improve the reliability and the safety of a liquid-cooled module by discharging liquid having a boiling point higher than coolant into the module when a semiconductor abnormally generates heat, thereby preventing a film from boiling. CONSTITUTION:When a semiconductor element (element) 11 operates and generates heat, the heat is transmitted via boiling heat conduction to coolant 12, the element 11 is cooled. When the element 11 generates heat more than designed so that the film approaches to boiling, a valve 13 is opened by a temperature sensor utilizing the circuit in the element 11, high boiling point coolant 4 is discharged, the boiling point of the coolant 12 is thereby raised, the cooled state of the element 11 is recovered to the normal boiling state, and the valve 13 is closed. In this manner, even if the element 11 generates heat more than designed, the element is not damaged due to the film boiling, and the explosion accident due to the pressure rise in the module can be prevented. |
