| 摘要 |
PURPOSE:To manufacture a semiconductor wafer having no warp by a method wherein a flatness degree measuring instrument, by which the flatnes degree of a substrate to support an edge part is measured, is provided. CONSTITUTION:A substrate 11 consiting of a ring-shaped disc is provided on a base board 10 and the substrate 11 is disposed in a tense state by tightening members 12 for substrate tense disposition arranged at a prescribed interval on the outer peripheral edge parts thereof. A flatness degree measuring instrument 16, which is constituted of distance measuring instruments, is provided over the substrate 11 in such a way as to be able to be freely transferred in the peripheral direction. By measuring the distance between the substrate surface and the flatness degree measuring instrument 16, the flatness degree of the substrate 11 is inspected. A cyclindrical single crystal substance 13 is inserted in a penetrating hole 14 provided at the central part of the substrate 11, the substrate 11 is made to rotate and an edge part 15 provided at the inner peripheral edge part of the penetrating hole 14 is made to transfer in parallel to the diametral direction of the penetrating hole 14, thereby enabling to perform a slice processing on the monocrystal substance 13. |
