发明名称 LEAD WIRE CONNECTING METHOD FOR HIGH MOLECULAR PIEZOELECTRIC ULTRASONIC PROBE
摘要 PURPOSE:To improve the reliability and reproducibility of a connecting part by connecting a lead wire to a thick conductive film part formed in the end part of an electrode for driving and thereby providing an easy work of connecting such as soldering. CONSTITUTION:The high molecular piezoelectric bodies 1 and 1' are so disposed as the directions of their polarization axes oppose each other. Between the said bodies 1 and 1', a high molecular film 4 on which the electrodes for driving 3 are formed. On the rear surface of the body 1' is a reflecting plate 6 disposed, and is made acoustically integral with the body 1' with an adhesive 5. The thick film parts 3a are formed at the end of the electrodes 3 provided on the both surfaces of the film 4, which are electrically connected with a lead wire part 8 provided to a high molecular film 7 with the solder 9. Such a thickness of the said film prevents a damage on the electrodes 3 or cutting of them from occurring during the work of connecting the lead wire 8 with such as solder. Also, by using a heat resistant high molecular film against the high-temperature heating of the soldering part, the deforming of the electrodes 3 is prevented from occurring. And further, by making the electrodes 3 long, the thermal conduction is suppressed, by which the depolarization of the bodies 1 and 1' is removed preventing the lowering of the characteristic.
申请公布号 JPS61293098(A) 申请公布日期 1986.12.23
申请号 JP19850133986 申请日期 1985.06.21
申请人 TOSHIBA CORP 发明人 KANEKO NAGAO;NAKAMURA NANAO;KOYAMA MASAO;SAITO SHIRO;HONDA HIROKI
分类号 H04R17/00;G01H11/08;G01N29/04;G01N29/24;H04R1/06 主分类号 H04R17/00
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