| 摘要 |
A conductor (a1/a2), manufactured in a substrate surface layer, for supplying an overvoltage-sensitive component (RL) is manufactured, for example, using printed circuit board technology by copper cladding and photolithography and/or using thick-film technology by screen printing and/or using thin-film technology and/or using semiconductor technology by vapour deposition and photolithography. To protect the component (RL) against high parasitic voltage peaks induced, for example, by lightning, a conductor extension (BP1/BP2) manufactured together with the conductor (a1/a2) almost completely shunts the component (RL) electrically, but the shunting conductor extension (BP1/BP2 with SGF) has a gap (LBT1 in SGF) which acts as a spark gap in the event of overvoltage. <IMAGE>
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