发明名称 INTERCONNECT ARRANGEMENT FOR PRINTED CIRCUITS
摘要 A printed circuit assembly comprises a first printed circuit having conductive paths formed on a top surface thereof and a second printed circuit having conductive paths formed on a top surface thereof. The first printed overlies the second circuit in a staggered relationship so that an edge thereof lies on the top surface of the second printed circuit. The second printed circuit has a portion protruding beyond this edge. A first set of contact members is formed on the first printed circuit adjacent its edge. A second set of corresponding contact members is formed on the protruding portion of the first printed circuit in opposing relationship to the first set of contact members. A sheet member is fitted over the printed circuits and carries bridging members for establishing electrical contact between corresponding pairs of contact members.
申请公布号 CA2182237(A1) 申请公布日期 1998.01.30
申请号 CA19962182237 申请日期 1996.07.29
申请人 MITEL CORPORATION 发明人 MCLEOD, ROB
分类号 H01R12/00;H05K3/32;H05K3/36;(IPC1-7):H05K1/11 主分类号 H01R12/00
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