| 摘要 |
PURPOSE:To remove rejected chip without contact with the adjacent one retaining then at the center by detecting the rejection mark after a quick, automatic positioning thereof with the image output region of the camera reduced to its minimum. CONSTITUTION:A jig on which a semiconductor chip is laid in a matrix array is placed on x, y and theta bases 11. With the command 30, a rough positioning 10 is made to pick up the optical image of the chip into the camera 50. The scanning zone is set to effect photoelectric conversion of the signel only limited to minimum area of the chip to be inspected. The binary signal thus obtained is sent to a changeover circuit 70 to detect the position as shown by 80. After the removal of noises or the like, the quadrilateral thus obtatined is compared with the reference information 81 to correct the base 11 by computing the position errors. Then, the scanning zone is set 40 to allow the camera 50 to produce the output to the quadrilateral area small than the end side of the chip and the binary signal is sent to the circuit 70 to detect 90 the rejection marks in sequence. During the inspection, with the command 30, the chip 3 is ejected from the sheet 1 through a mechanism control section 100 and removed 102 by a suction nozzle. |
