LOW TEMPERATURE INTEGRATED CIRCUIT DIE ATTACHMENT PROCESS

摘要

A method of attaching an integrated circuit die to an underlying substrate includes the steps of coating the back surface of the integrated circuit with silver, coating the surface of the substrate with at least one of gold, silver, platinum and palladium and attaching the surface of the integrated circuit to the surface of the substrate with a melted composition of gold and tin. The gold/tin is typically 80% gold and 20% tin by weight.