Apparatus for solder tinning of component leads

摘要

Method and apparatus which allows the component leads of pre-taped electronic components to be solder tinned to preserve the solderability and shelf life of such component leads. Pre-taped electronic components and the like are prepackaged in a reel and positioned in the apparatus such that the reel is free to rotate. Both leads of each component are secured to corresponding adjacent component leads by tape. The electronic components are moved through a plurality of processing stages such that one lead of each component is solder tinned, one of the processing stages removing the tape from the leads to enable the soldering thereof. After soldering of the leads, tape is applied thereto. The process is then repeated for the other leads of each component.