Lead frame for molded integrated circuit package

摘要

A lead frame for a molded semiconductor device package. The lead frame has a pattern of finger leads with convergent free inner ends and dam bars between adjacent finger leads. The dam bars are partially severed from their contiguous finger leads due to cuts on their edges intended to face a body member molded over the finger lead inner ends. The partially severed dam bar edge is preferably positioned to be substantially at the periphery of the molded body member. The resultant molded body member can thus have a finished surface even between the finger leads as molded and dam bar cutting die wear reduced.