UN PROCEDIMIENTO PARA FABRICAR UNA ESTRUCTURA DE MULTIPLES CAPAS SOLDABLE POR CALOR

摘要

A multilayer oriented heat sealable film structure comprising a polyolefin film substrate, a coextruded layer of random copolymer of ethylene and propylene, a primer layer on said random copolymer layer and a layer of heat sealable acrylic interpolymer on said primer layer.