| 摘要 |
The machine for cutting brittle materials such as piezoelectric or semiconductor devices includes a drive motor having a spool of new wire fixed to its shaft. The wire is taken-up by another drive motor and a spool, the motors maintaining a constant movement of the wire between them. The wire is engaged by guide idler pulleys and a fixed multi groove pulley and extends to a web with three parallel pulleys, so that the wire forms a generally triangular web with a flat side of the triangle defining a cutting area. The material to be cut is mounted above the cutting area on a block dovetailed to slide vertically on a base, with a piece of the material on a platform fixed to the lower end of the block. |
