LEGA DI RAME DEBOLMENTE LEGATA PROCEDIMENTO PER LA SUA PREPARAZIONE E IMPIEGO

摘要

A low-alloyed copper alloy suitable for use as a base material for a semiconductor includes 0.03 to 0.2% nickel by weight, 0.03 to 0.2% tin by weight; and 0.015 to 0.1% titanium by weight, the remainder being copper and common impurities.