| 摘要 |
PURPOSE:To eliminate the risk of short-circuit and improve integration density and welding intensity of wire providing a plurality of bonding areas between the other end of wire and electrode part of circuit substrate and giving the sequencial numbering to formation of bonding areas in the sequence from the further area from the semiconductor chip to the nearer area. CONSTITUTION:The one end 4a of wire 4 is welded to the bonding area 7 at the upper surface of semiconductor chip 1 and the other end 4b of wire 4 is welded to the first bonding area 9a at the furtherest area 10 from the semiconductor chip 1 on the electrode part 5. The second bonding area 9b is welded at the area a little nearer to the semiconductor chip 1 than the bonding area 9a. Moreover, the third bonding area 9c is welded at the area 11 more nearer to the semiconductor chip 1. In this way, a plurality of bonding areas are formed. When the wire 4 is pressed on the electrode part 5 by the end point of capillary 12 and thereby the second bonding area 9b is provided and is welded, the wire 4 extends in the longitudinal direction, but since the wire 4 cannot extend in the direction of bonding 9a due to the already provided bonding part 9a, it extends in the side of semiconductor chip 1. |
