| 摘要 |
PURPOSE:To eliminate the abrasion of support needle which supports the lower side of pellet and damage of pellet and realize high speed of pick-up process by adsorbing the pellet with the adsorbing collet in such a condition that the wafer sheet is extended by the sleeve at the upper position of wafer ring. CONSTITUTION:A wafer sheet 11 on which a pellet 10 is attached is extended on the wafter ring 13. The adsorbing collet 17 disposed at the upper part of wafer sheet 11, the sleeve disposed at the rear side of wafer sheet 11 and the support needle 16 which moves agaist said sleeve are closely moved and thereby the pellet 10 is adsorbed by the adsorbing collet 17 at the position located at the upper part of the surface of wafer ring 13. Thereafter, while the pellet 10 is supported by the supporting needle 16, the sleeve 15 is moved backward from the adsorbing collet 17. Thereafter, the pedestal 12 is fed by one pitch so that the pellet 10 to be picked up next is located just above the support needle 16 and the same operations are repeated. |
