发明名称 WIRE BONDING METHOD
摘要 PURPOSE:To remarkably reduce a chance of suspending the automated wire bonding machine by continuing the wire bonding after forming a new first ball through the extra bonding on the gold provided at the position fixed on a heater block. CONSTITUTION:As the gold 7 provided at the adequate position fixed on a heater block 1, for example, those obtained by plating gold on the surface of adequate metal plate or by adhering gold through previous extra bonding on the surface of adequate metal plate. If opening of first bonding is defective, execute extra bonding on said gold 7 in order to form a new first bonding. The first ball can be formed by any method of hydrogen torch or electric torch.
申请公布号 JPS59229830(A) 申请公布日期 1984.12.24
申请号 JP19830103420 申请日期 1983.06.09
申请人 ROOMU KK 发明人 KAMIYAMA SUSUMU
分类号 H01L21/60 主分类号 H01L21/60
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