发明名称 PHOTOSENSITIVE COMPOSITION
摘要 PROBLEM TO BE SOLVED: To obtain the photosensitive composition capable of developing with an aqueous alkaline developing solution and forming a heat resistant pattern superior in photosensitivity and resolution and enhancing storage stability in a state of solution by incorporating a specified hydroxypolyamide and a compound to be allowed to generate an acid by irradiation with radiation and a compound capable of cross-linking the hydroxypolyamide by action of the acid. SOLUTION: This photosensitive composition contains (A) 100 pts.wt. of the hydroxypolyamide having structural units represented by formulae I and II, (B) 0.5-20 pts.wt. of the compound to be allowed to generate the acid by irradiation with radiation, and (C) 3-40 pts.wt. of the compound capable of cross-linking the hydroxypolyamide of (A). In formulae I and II, R1 is a tetravalent aromatic group; each of R2 and R4 is, independently, a divalent organic group; R3 is a divalent organic group; and each of (a) and (b) is each fraction (%) of structural units; (a) is 10-100, (b) is 0-90, and (a+b) is 100.
申请公布号 JPH11153866(A) 申请公布日期 1999.06.08
申请号 JP19970319588 申请日期 1997.11.20
申请人 ASAHI CHEM IND CO LTD 发明人 TAKAHASHI HIDEAKI;SAKAI MIYUKI
分类号 G03F7/004;G03F7/038;H01L21/027;H01L21/312;(IPC1-7):G03F7/038 主分类号 G03F7/004
代理机构 代理人
主权项
地址
您可能感兴趣的专利