| 摘要 |
PURPOSE:A resin composition excellent in heat resistance, mechanical properties, and slidability against light metals, prepared by mixing a thermoplastic resin containing a polymaleimide/aminophenol adduct and an epoxy compound with a specified composite filler. CONSTITUTION:A composition is prepared by mixing 30-70wt% thermosetting resin containing an adduct between a polymaleimide of formula I (wherein R<1> is an n-valent organic group, X<1> and X<2> are each H, a halogen atom or an atomic group, and n>=2) and an aminophenol of formula II (wherein R<2> is H, a halogen atom, or an organic group, and m is 1-5) and an epoxy compound having at least two epoxy groups in the molecule with 70-30wt% composite filler containing 50-83wt% fluorocarbon resin and 38-5wt% aromatic polyamide resin. When the proportion of the thermosetting resin is below 30wt%, the workability and moldability are poor, while when it exceeds 70wt%, it is impossible to obtain a molding of desired properties.
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