| 摘要 |
PURPOSE:To make it possible to cure an epoxy resin at low temperatures, by using a curing agent comprising an imidazole-blocked isocyanate. CONSTITUTION:An epoxy resin is cured with the aid of curing agent comprising an imidazole-blocked isocyanate. Examples of the isocyanate compounds used include allkylene diisocyanates, unsaturated isocyanates, aromatic isocyanates, and prepolymers having isocyanate groups on both ends. Examples of the imidazoles include 2-methylimidazole and, 2-etyl-4methylimidazole. The cuirng agent may act in such a manner that regenerated imidazole first effects the opening of epoxy rings, and the formed hydroxyl groups further react with the isocyanate.
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