| 发明名称 |
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| 摘要 |
PURPOSE:To simplify detachment by a vacuum chuck at the time of separating a semiconductor wafer adhered to a mask by generating wedge action by blowing a gas mainly on the circumference of a wafer adhesive surface. |
| 申请公布号 |
JPS5952536(B2) |
申请公布日期 |
1984.12.20 |
| 申请号 |
JP19770100494 |
申请日期 |
1977.08.24 |
| 申请人 |
HITACHI LTD |
发明人 |
TANAKA YOSHIMITSU;ASAMI YASUSHI |
| 分类号 |
H01L21/30;G03C5/08;G03F1/00;G03F1/76;G03F7/004;G03F7/20;H01L21/027;H01L21/302 |
主分类号 |
H01L21/30 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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