发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To prevent a damage by static electricity deformation of conductors, short and breakage by putting an external end of the conductor for electrical connection with the external circuit in a recess arranged on an outer wall of the outer surrounding container completely. CONSTITUTION:On a sealing contact surface of a ceramic base 1, low-melting- point glass 3 is apllied, on which a conductor 6 adheres. The conductor 6 is bent at right angles in a halfway position and the front end is bent inversely in a certain shape. At completion, it is in contact with a conductor 7 for connection of the substrate by a proper pressure. The conductor 6 exists inside the outer wall of the ceramic base 1. After fixing the conductors, a semiconductor element 8 is fixed to the predetermined position of the ceramic base by eutectic method or the like and a junction pad of the element 8 is connected to the internal end of the conductor by connection 9. Lastly, a ceramic lid 2 on which the low-melting-point glass 3 is applied on the sealing contact surface is positioned and is fixed temporarily, after which sealing is carried out in a high temperature atmosphere of about 500 deg.C. This constitution offers the semiconductor device easy in handling.
申请公布号 JPS59227142(A) 申请公布日期 1984.12.20
申请号 JP19830100902 申请日期 1983.06.08
申请人 MATSUSHITA DENSHI KOGYO KK 发明人 OKAMOTO TOMIO
分类号 H01L23/12;H01L21/00;H01L23/057;H01L23/495;H01L23/50 主分类号 H01L23/12
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